EN
Based on the application requirements of phased array products, the company has successfully developed a series of chips and modules with different packaging processes,
antenna arrays and other products with completely independent intellectual property rights. The products cover the X, K,Ku, Ka and other frequency bands.
We fully leverage the advantages of high integration of silicon-based CMOS technology and high millimeter-wave performance of compound semiconductor technology,
use hybrid packaging technology to achieve heterogeneous integration, and successfully develop a series of hybrid packaging chips with completely independent intellectual property rights.
